Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.

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Standards & Documents Search | JEDEC

Printing in the indicating spot colored area will affect hue measurement. Any standard involving a complex technology draws material from a vast number of sources. The spots shall indicate the humidity with a signi? Spots without printing shall be tested. Any SMD package that has not exceeded its?

However, if the conditions of Clause 4.

Water clean processes after the? It is intended to make the HIC test method and criteria a separate standard in the future. The heat absorbed by the package body from such operations is typically much lower than for bulk surface mount re?

Standards & Documents Search

If the time limit is exceeded the packages should be baked according to Table to restore the? In most cases it is applicable to other nonhermetic surface mount SMD packages. If SMD packages are placed in dry bags with unbaked carriers, refer to Clause 3. A solution for addressing this problem is to derate the exposure times based on the knowledge of moisture diffusion in the component packaging materials refer to JESDA Table summarizes conditions for resetting or pausing the?

Acceptable safe storage conditions for SMD packages classi? The following conditions apply regardless of the storage time i. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of JEDEC or IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than JEDEC and IPC members, whether the standard is to be used either domestically or internationally.


If a higher bake temperature is required, SMD packages must be removed from the low temperature carriers to thermally safe carriers, baked, and returned to the low temperature carriers.

For components exposed anytime less than their stated? The supplier should be consulted. Set the chamber to the? Storage in a dry cabinet may be considered equivalent to storage in a dry pack with unlimited shelf life.

Level 2 parts are still adequately dry. With component and board temperature restrictions in mind, choose a bake temperature from Table ; then determine the appropriate bake duration based on the component to be removed. An example HIC is shown in Figure Francois Monette, Cogiscan Inc. Marty Rodriguez, Jabil Circuit, Inc. Amol Kirtikar, Sud-Chemie Inc. Also the actual bake time may be reduced if technically justi? Calculated shelf life in sealed bag: This method will minimize moisture related component damage.

If one hour exposure is exceeded, refer to Clause 4. Table is based on worst-case molded lead frame SMD packages. This may present an additional risk, which should be evaluated. The temperature and time for baking SMD packages are therefore limited by solderability considerations. Special consideration should be given to non-hermetic cavity packages. If the calculated shelf life is greater than 12 months, item 1 of the caution label should be changed accordingly. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent j-stc-033b.1.


The caution label shall be affixed to jeddc outside surface of the MBB. Other color schemes may be used. The period between drying and sealing must not exceed the MET less the time allowed for distributors to open the bags and repack parts.

By using these procedures, safe and damage-free re? This value should to be obtained from the desiccant manufacturer. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States. While the principal members of the Joint Moisture J-std-03b.1

When identifying a bake cycle, the maximum exposure temperature and maximum rate of temperature change of components and materials on the subject printed wiring assembly must be considered, and an appropriate time temperature pro? Set the chamber for the next humidity and continue in this manner until data has been jedev for all conditions.

When this option is used, it must be veri?

If the bags are opened under factory ambient conditions, see Clause 4. Paper and Plastic Container Items Maurice Brodeur, Analog Devices Inc.

Peak package body temperature: If the bag is to be resealed refer to Clause 4. If dried and sealed j-shd-033b.1 an MBB with fresh desiccant, the shelf life is reset. I recommend changes to the following: The caution label includes?

When dry packing, the desiccant shall be removed from the storage container just prior to placing it into the MBB and sealing the MBB.